| // SPDX-License-Identifier: GPL-2.0+ | |
| /* | |
| * Copyright (C) 2024-2025 Renesas Electronics Corp. | |
| */ | |
| #ifndef __INCLUDE_DBSC5_H__ | |
| #define __INCLUDE_DBSC5_H__ | |
| /* The number of channels V4H has */ | |
| #define DRAM_CH_CNT 4 | |
| /* The number of slices V4H has */ | |
| #define SLICE_CNT 2 | |
| /* The number of chip select V4H has */ | |
| #define CS_CNT 2 | |
| struct renesas_dbsc5_board_config { | |
| /* Channels in use */ | |
| u8 bdcfg_phyvalid; | |
| /* Read vref (SoC) training range */ | |
| u32 bdcfg_vref_r; | |
| /* Write vref (MR14, MR15) training range */ | |
| u16 bdcfg_vref_w; | |
| /* CA vref (MR12) training range */ | |
| u16 bdcfg_vref_ca; | |
| /* RFM required check */ | |
| bool bdcfg_rfm_chk; | |
| /* Board parameter about channels */ | |
| struct { | |
| /* | |
| * 0x00: 4Gb dual channel die / 2Gb single channel die | |
| * 0x01: 6Gb dual channel die / 3Gb single channel die | |
| * 0x02: 8Gb dual channel die / 4Gb single channel die | |
| * 0x03: 12Gb dual channel die / 6Gb single channel die | |
| * 0x04: 16Gb dual channel die / 8Gb single channel die | |
| * 0x05: 24Gb dual channel die / 12Gb single channel die | |
| * 0x06: 32Gb dual channel die / 16Gb single channel die | |
| * 0x07: 24Gb single channel die | |
| * 0x08: 32Gb single channel die | |
| * 0xFF: NO_MEMORY | |
| */ | |
| u8 bdcfg_ddr_density[CS_CNT]; | |
| /* SoC caX([6][5][4][3][2][1][0]) -> MEM caY: */ | |
| u32 bdcfg_ca_swap; | |
| /* SoC dqsX([1][0]) -> MEM dqsY: */ | |
| u8 bdcfg_dqs_swap; | |
| /* SoC dq([7][6][5][4][3][2][1][0]) -> MEM dqY/dm: (8 means DM) */ | |
| u32 bdcfg_dq_swap[SLICE_CNT]; | |
| /* SoC dm -> MEM dqY/dm: (8 means DM) */ | |
| u8 bdcfg_dm_swap[SLICE_CNT]; | |
| /* SoC ckeX([1][0]) -> MEM csY */ | |
| u8 bdcfg_cs_swap; | |
| } ch[DRAM_CH_CNT]; | |
| }; | |
| #endif /* __INCLUDE_DBSC5_H__ */ |